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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Additive Metallization of Alumina with Copper-Titanium Powd..:
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2020 43rd International Spring Seminar on Electronics Technology (ISSE) ,
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Solderability of Injection Moldable Thermoset Resins for Us..:
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Transdisziplinär und transformativ forschen, Band 2 ,
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