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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
9
Influences of bonding process parameters on mechanical prop..:
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2023 China Semiconductor Technology International Conference (CSTIC) ,
11
Mechanical Properties of Flip-Chip Bonding Structures for M..:
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2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) ,
13
Hybrid bonding thermodynamic simulation of 3×3 array of Mic..:
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2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) ,
15