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1 Ergebnisse
1
Thick film technology and chip joining
Processes and materials in electronics ; 1
Miller, Lewis F.
, 1972
Exemplar:
Zentrale:Magazin
01.n.2531
RT Book, Whole T1 <Title>Thick film technology and chip joining</Title> UL https://suche.suub.uni-bremen.de/peid=B04022662&Exemplar=1&LAN=DE A1 Miller, Lewis F. PB Gordon and Breach PP New York [u.a.] YR 1972 NO 221 S : graph. Darst T3 Processes and materials in electronics ; 1 SN 0677034407 SN 9780677034409 VO 1 LK http://katalog.suub.uni-bremen.de/DB=1/LNG=DU/CMD?ACT=SRCHA&IKT=8000&TRM=18300480* CN Magazin: 01.n.2531 SF ELIB - SuUB Bremen
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