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Using lasers as safe alternatives for adhesive bonding
emerging research and opportunities Advances in chemical and materials engineering (ACME) book series
Ciecińska, Barbara Ewa
, [2020]
Link:
https://doi.org/10.4018/978-1-7998-4634-5
RT Book, Whole T1 <Title>Using lasers as safe alternatives for adhesive bonding</Title> : <SubTitle>emerging research and opportunities</SubTitle> UL https://suche.suub.uni-bremen.de/peid=B172549359&Exemplar=1&LAN=DE A1 Ciecińska, Barbara Ewa PB IGI Global PP Hershey, PA YR 2020 NO 1 Online-Ressource T3 Advances in chemical and materials engineering (ACME) book series SN 9781799846352 LK http://dx.doi.org/10.4018/978-1-7998-4634-5 DO 10.4018/978-1-7998-4634-5 LK http://https://doi.org/10.4018/978-1-7998-4634-5 SF ELIB - SuUB Bremen
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