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1 Ergebnisse
1
Chip scale package (CSP)
design, materials, processes, reliability, and applications Electronic packaging and interconnection series
Lau, John H.
, 1999
Exemplar:
Zentrale:Magazinturm E02
a elt 695 f/690
RT Book, Whole T1 <Title>Chip scale package (CSP)</Title> : <SubTitle>design, materials, processes, reliability, and applications</SubTitle> UL https://suche.suub.uni-bremen.de/peid=B25284099&Exemplar=1&LAN=DE A1 Lau, John H. PB McGraw-Hill PP New York, NY [u.a.] YR 1999 NO XXII, 564 S : Ill., graph. Darst T3 Electronic packaging and interconnection series SN 0070383049 SN 9780070383043 LK http://katalog.suub.uni-bremen.de/DB=1/LNG=DU/CMD?ACT=SRCHA&IKT=8000&TRM=36199028* CN Magazinturm E02: a elt 695 f/690 SF ELIB - SuUB Bremen
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