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Robust design of microelectronics assemblies against mechan..
Woodhead publishing series in electronic and optical materials ; number 81
Wong, Ee-Hua
;
Mai, Yiu-Wing
, [2015]
Exemplar:
Zentrale:Magazin
03.k.0521
RT Book, Whole T1 <Title>Robust design of microelectronics assemblies against mechanical shock, temperature and moisture</Title> UL https://suche.suub.uni-bremen.de/peid=B62513795&Exemplar=1&LAN=DE A1 Wong, Ee-Hua A1 Mai, Yiu-Wing PB Elsevier, WP Woodhead Publishing is an imprint of Elsevier PP Amsterdam YR 2015 NO xviii, 457 Seiten : Illustrationen, Diagramme T3 Woodhead publishing series in electronic and optical materials ; number 81 SN 9781845695286 VO number 81 LK http://katalog.suub.uni-bremen.de/DB=1/LNG=DU/CMD?ACT=SRCHA&IKT=8000&TRM=1158003935* CN Magazin: 03.k.0521 SF ELIB - SuUB Bremen
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