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1 Ergebnisse
1
A boundary-element approach to transient simulation of thre..:
, In:
Proceedings of the 29th ACM/IEEE Design Automation Conference
,
Ling, D. D.
;
Kim, S.
;
White, J.
- p. 93-98 , 1992
Link:
https://dl.acm.org/doi/10.5555/113938.110423
RT T1 <cTitle>Proceedings of the 29th ACM/IEEE Design Automation Conference</cTitle>: T1 <Title>A boundary-element approach to transient simulation of three-dimensional integrated circuit interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=acm-110423&Exemplar=1&LAN=DE A1 Ling, D. D. A1 Kim, S. A1 White, J. PB IEEE Computer Society Press YR 1992 K1 Hardware K1 Integrated circuits K1 Interconnect K1 Metallic interconnect K1 Very large scale integration design K1 Emerging technologies K1 Applied computing K1 Physical sciences and engineering K1 Engineering K1 Hardware validation K1 Functional verification K1 Simulation and emulation SP 93 OP 98 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/113938.110423 DO https://dl.acm.org/doi/10.5555/113938.110423 SF ELIB - SuUB Bremen
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