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Design and CAD for 3D integrated circuits:
, In:
Proceedings of the 45th annual Design Automation Conference
,
Franzon, Paul D.
;
Davis, W. Rhett
;
Steer, Michael B.
... - p. 668-673 , 2008
Link:
https://dl.acm.org/doi/10.1145/1391469.1391642
RT T1 <cTitle>Proceedings of the 45th annual Design Automation Conference</cTitle>: T1 <Title>Design and CAD for 3D integrated circuits</Title> UL https://suche.suub.uni-bremen.de/peid=acm-1391642&Exemplar=1&LAN=DE A1 Franzon, Paul D. A1 Davis, W. Rhett A1 Steer, Michael B. A1 Lipa, Steve A1 Oh, Eun Chu A1 Thorolfsson, Thor A1 Melamed, Samson A1 Luniya, Sonali A1 Doxsee, Tad A1 Berkeley, Stephen A1 Shani, Ben A1 Obermiller, Kurt PB ACM YR 2008 K1 3DIC K1 TSV K1 thermal modeling K1 through silicon via K1 Hardware K1 Integrated circuits K1 Very large scale integration design K1 Emerging technologies SP 668 OP 673 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/1391469.1391642 DO https://dl.acm.org/doi/10.1145/1391469.1391642 SF ELIB - SuUB Bremen
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