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Area-I/O flip-chip routing for chip-package co-design:

, In: Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design,
Fang, Jia-Wei ; Chang, Yao-Wen - p. 518-522 , 2008
Link: https://dl.acm.org/doi/10.5555/1509456.1509572