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Pad assignment for die-stacking System-in-Package design:

, In: Proceedings of the 2009 International Conference on Computer-Aided Design,
Lin, Yu-Chen ; Mak, Wai-Kei ; Chu, Chris. - p. 249-255 , 2009
Link: https://dl.acm.org/doi/10.1145/1687399.1687445