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Fast 3-D thermal analysis of complex interconnect structure..:

, In: Proceedings of the 2009 International Conference on Computer-Aided Design,
Xu, Chuan ; Jiang, Lijun ; Kolluri, Seshadri K.... - p. 658-665 , 2009
Link: https://dl.acm.org/doi/10.1145/1687399.1687521