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TSV redundancy : architecture and design issues in 3D IC:

, In: Proceedings of the Conference on Design, Automation and Test in Europe,
Hsieh, Ang-Chih ; Hwang, TingTing ; Chang, Ming-Tung... - p. 166-171 , 2010
Link: https://dl.acm.org/doi/10.5555/1870926.1870967