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1 Ergebnisse
1
Homogeneous integration for 3D IC with TSV:
, In:
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
,
Kwai, Ding-Ming
- p. 546-547 , 2010
Link:
https://dl.acm.org/doi/10.5555/1899721.1899851
RT T1 <cTitle>Proceedings of the 2010 Asia and South Pacific Design Automation Conference</cTitle>: T1 <Title>Homogeneous integration for 3D IC with TSV</Title> UL https://suche.suub.uni-bremen.de/peid=acm-1899851&Exemplar=1&LAN=DE A1 Kwai, Ding-Ming PB IEEE Press YR 2010 K1 Hardware K1 Emerging technologies SP 546 OP 547 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/1899721.1899851 DO https://dl.acm.org/doi/10.5555/1899721.1899851 SF ELIB - SuUB Bremen
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