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1 Ergebnisse
1
ILP-based inter-die routing for 3D ICs:
, In:
Proceedings of the 16th Asia and South Pacific Design Automation Conference
,
Chang, Chia-Jen
;
Huang, Pao-Jen
;
Chen, Tai-Chen
. - p. 330-335 , 2011
Link:
https://dl.acm.org/doi/10.5555/1950815.1950888
RT T1 <cTitle>Proceedings of the 16th Asia and South Pacific Design Automation Conference</cTitle>: T1 <Title>ILP-based inter-die routing for 3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=acm-1950888&Exemplar=1&LAN=DE A1 Chang, Chia-Jen A1 Huang, Pao-Jen A1 Chen, Tai-Chen A1 Liu, Chien-Nan Jimmy PB IEEE Press YR 2011 SP 330 OP 335 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/1950815.1950888 DO https://dl.acm.org/doi/10.5555/1950815.1950888 SF ELIB - SuUB Bremen
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