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1
Resistive analysis of mixed carbon nanotube bundle intercon..:
, In:
Proceedings of the International Conference & Workshop on Emerging Trends in Technology
,
Alam, T.
;
Dhiman, R.
;
Chandel, R.
- p. 1157-1160 , 2011
Link:
https://dl.acm.org/doi/10.1145/1980022.1980271
RT T1 <cTitle>Proceedings of the International Conference & Workshop on Emerging Trends in Technology</cTitle>: T1 <Title>Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect</Title> UL https://suche.suub.uni-bremen.de/peid=acm-1980271&Exemplar=1&LAN=DE A1 Alam, T. A1 Dhiman, R. A1 Chandel, R. PB ACM YR 2011 K1 copper K1 interconnect K1 mixed carbon nanotube bundle K1 Hardware K1 Emerging technologies K1 Very large scale integration design SP 1157 OP 1160 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/1980022.1980271 DO https://dl.acm.org/doi/10.1145/1980022.1980271 SF ELIB - SuUB Bremen
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