I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

TSV-aware analytical placement for 3D IC designs:

, In: Proceedings of the 48th Design Automation Conference,
Hsu, Meng-Kai ; Chang, Yao-Wen ; Balabanov, Valeriy - p. 664-669 , 2011
Link: https://dl.acm.org/doi/10.1145/2024724.2024875