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1
A linear-time approach for the transient thermal simulation..:
, In:
Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis
,
Fourmigue, Alain
;
Beltrame, Giovanni
;
Nicolescu, Gabriela
. - p. 197-206 , 2011
Link:
https://dl.acm.org/doi/10.1145/2039370.2039402
RT T1 <cTitle>Proceedings of the seventh IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis</cTitle>: T1 <Title>A linear-time approach for the transient thermal simulation of liquid-cooled 3d ics</Title> UL https://suche.suub.uni-bremen.de/peid=acm-2039402&Exemplar=1&LAN=DE A1 Fourmigue, Alain A1 Beltrame, Giovanni A1 Nicolescu, Gabriela A1 Aboulhamid, El Mostapha PB ACM YR 2011 K1 3d ic K1 compact thermal model K1 finite difference method K1 liquid-cooling K1 Hardware K1 Hardware validation K1 Functional verification K1 Simulation and emulation SP 197 OP 206 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/2039370.2039402 DO https://dl.acm.org/doi/10.1145/2039370.2039402 SF ELIB - SuUB Bremen
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