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1 Ergebnisse
1
Small delay testing for TSVs in 3-D ICs:
, In:
Proceedings of the 49th Annual Design Automation Conference
,
Huang, Shi-Yu
;
Lin, Yu-Hsiang
;
Tsai, Kun-Han (Hans)
... - p. 1031-1036 , 2012
Link:
https://dl.acm.org/doi/10.1145/2228360.2228546
RT T1 <cTitle>Proceedings of the 49th Annual Design Automation Conference</cTitle>: T1 <Title>Small delay testing for TSVs in 3-D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=acm-2228546&Exemplar=1&LAN=DE A1 Huang, Shi-Yu A1 Lin, Yu-Hsiang A1 Tsai, Kun-Han (Hans) A1 Cheng, Wu-Tung A1 Sunter, Stephen A1 Chou, Yung-Fa A1 Kwai, Ding-Ming PB ACM YR 2012 K1 3D IC K1 TSV testing K1 design for testability K1 small delay testing K1 Hardware K1 Hardware test K1 Robustness SP 1031 OP 1036 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/2228360.2228546 DO https://dl.acm.org/doi/10.1145/2228360.2228546 SF ELIB - SuUB Bremen
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