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1 Ergebnisse
1
Test challenges in designing complex 3D chips : what is ..:
, In:
Proceedings of the International Conference on Computer-Aided Design
,
Goel, Sandeep Kumar
- p. 273 ff. , 2012
Link:
https://dl.acm.org/doi/10.1145/2429384.2429438
RT T1
Proceedings of the International Conference on Computer-Aided Design
: T1
Test challenges in designing complex 3D chips : what is on the horizon for EDA industry?
UL https://suche.suub.uni-bremen.de/peid=acm-2429438&Exemplar=1&LAN=DE A1 Goel, Sandeep Kumar PB ACM YR 2012 K1 3D stacked ICs K1 design-for-test K1 silicon interposer K1 test architecture and wrappers K1 Applied computing K1 Physical sciences and engineering K1 Engineering K1 Computer-aided design K1 Arts and humanities K1 Architecture (buildings) K1 Hardware K1 Hardware validation K1 Electronic design automation K1 Physical design (EDA) SP 273 ff. LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/2429384.2429438 DO https://dl.acm.org/doi/10.1145/2429384.2429438 SF ELIB - SuUB Bremen
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