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An enhanced double-TSV scheme for defect tolerance in 3D-IC:

, In: Proceedings of the Conference on Design, Automation and Test in Europe,
Shih, Hsiu-Chuan ; Wu, Cheng-Wen - p. 1486-1489 , 2013
Link: https://dl.acm.org/doi/10.5555/2485288.2485640