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1 Ergebnisse
1
Multiple chip planning for chip-interposer codesign:
, In:
Proceedings of the 50th Annual Design Automation Conference
,
Ho, Yuan-Kai
;
Chang, Yao-Wen
- p. 1-6 , 2013
Link:
https://dl.acm.org/doi/10.1145/2463209.2488767
RT T1 <cTitle>Proceedings of the 50th Annual Design Automation Conference</cTitle>: T1 <Title>Multiple chip planning for chip-interposer codesign</Title> UL https://suche.suub.uni-bremen.de/peid=acm-2488767&Exemplar=1&LAN=DE A1 Ho, Yuan-Kai A1 Chang, Yao-Wen PB ACM YR 2013 K1 2.5D-IC K1 codesign K1 interposer K1 physical design K1 Hardware K1 Electronic design automation K1 Physical design (EDA) SP 1 OP 6 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/2463209.2488767 DO https://dl.acm.org/doi/10.1145/2463209.2488767 SF ELIB - SuUB Bremen
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