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Contactless Stacked-die Testing for Pre-bond Interposers:

, In: Proceedings of the 51st Annual Design Automation Conference,
Chien, Jui-Hung ; Hsu, Ruei-Siang ; Lin, Hsueh-Ju.. - p. 1-6 , 2014
Link: https://dl.acm.org/doi/10.1145/2593069.2593111