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Design and analysis of 3D IC-based low power stereo matchin..:
, In:
Proceedings of the 2013 International Symposium on Low Power Electronics and Design
,
Ok, Seung-Ho
;
Bae, Kyeong-ryeol
;
Lim, Sung Kyu
. - p. 15-20 , 2013
Link:
https://dl.acm.org/doi/10.5555/2648668.2648675
RT T1 <cTitle>Proceedings of the 2013 International Symposium on Low Power Electronics and Design</cTitle>: T1 <Title>Design and analysis of 3D IC-based low power stereo matching processors</Title> UL https://suche.suub.uni-bremen.de/peid=acm-2648675&Exemplar=1&LAN=DE A1 Ok, Seung-Ho A1 Bae, Kyeong-ryeol A1 Lim, Sung Kyu A1 Moon, Byungin PB IEEE Press YR 2013 K1 3D IC K1 TSV K1 low-power design K1 stereo matching processor K1 Hardware K1 Emerging technologies K1 Very large scale integration design K1 Applied computing K1 Physical sciences and engineering K1 Electronics K1 Electronic design automation K1 Physical design (EDA) SP 15 OP 20 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/2648668.2648675 DO https://dl.acm.org/doi/10.5555/2648668.2648675 SF ELIB - SuUB Bremen
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