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1 Ergebnisse
1
Three-Tier 3D ICs for More Power Reduction : Strategies ..:
, In:
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design
,
Song, Taigon
;
Panth, Shreepad
;
Chae, Yoo-Jin
. - p. 752-757 , 2015
Link:
https://dl.acm.org/doi/10.5555/2840819.2840923
RT T1
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design
: T1
Three-Tier 3D ICs for More Power Reduction : Strategies in CAD, Design, and Bonding Selection
UL https://suche.suub.uni-bremen.de/peid=acm-2840923&Exemplar=1&LAN=DE A1 Song, Taigon A1 Panth, Shreepad A1 Chae, Yoo-Jin A1 Lim, Sung Kyu PB IEEE Press YR 2015 K1 3D IC K1 F2F K1 TSV K1 low power K1 Hardware K1 Very large scale integration design K1 Emerging technologies K1 Applied computing K1 Arts and humanities K1 Architecture (buildings) K1 Computer-aided design K1 Electronic design automation K1 Physical design (EDA) K1 Physical sciences and engineering K1 Engineering SP 752 OP 757 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/2840819.2840923 DO https://dl.acm.org/doi/10.5555/2840819.2840923 SF ELIB - SuUB Bremen
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