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1 Ergebnisse
1
Compact-2D : A Physical Design Methodology to Build Comm..:
, In:
Proceedings of the 2018 International Symposium on Physical Design
,
Ku, Bon Woong
;
Chang, Kyungwook
;
Lim, Sung Kyu
- p. 90-97 , 2018
Link:
https://dl.acm.org/doi/10.1145/3177540.3178244
RT T1
Proceedings of the 2018 International Symposium on Physical Design
: T1
Compact-2D : A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs
UL https://suche.suub.uni-bremen.de/peid=acm-3178244&Exemplar=1&LAN=DE A1 Ku, Bon Woong A1 Chang, Kyungwook A1 Lim, Sung Kyu PB ACM YR 2018 K1 compact-2D K1 face-to-face (F2F) bonded 3D ICs K1 physical design methodology K1 wafer-level bonding K1 Hardware K1 Electronic design automation K1 Physical design (EDA) K1 Integrated circuits K1 3D integrated circuits SP 90 OP 97 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3177540.3178244 DO https://dl.acm.org/doi/10.1145/3177540.3178244 SF ELIB - SuUB Bremen
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