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Thermal modeling and design on smartphones with heat pipe c..:

, In: Proceedings of the 36th International Conference on Computer-Aided Design,
Chiou, Hong-Wen ; Lee, Yu-Min ; Hsiao, Hsuan-Hsuan. - p. 482-489 , 2017
Link: https://dl.acm.org/doi/10.5555/3199700.3199764