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1 Ergebnisse
1
Redistribution layer routing for wafer-level integrated fan..:
, In:
Proceedings of the 36th International Conference on Computer-Aided Design
,
Lin, Ting-Chou
;
Chi, Chia-Chih
;
Chang, Yao-Wen
- p. 561-568 , 2017
Link:
https://dl.acm.org/doi/10.5555/3199700.3199775
RT T1 <cTitle>Proceedings of the 36th International Conference on Computer-Aided Design</cTitle>: T1 <Title>Redistribution layer routing for wafer-level integrated fan-out package-on-packages</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3199775&Exemplar=1&LAN=DE A1 Lin, Ting-Chou A1 Chi, Chia-Chih A1 Chang, Yao-Wen PB IEEE Press YR 2017 SP 561 OP 568 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/3199700.3199775 DO https://dl.acm.org/doi/10.5555/3199700.3199775 SF ELIB - SuUB Bremen
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