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1 Ergebnisse
1
Mechanical strain and temperature aware design methodology ..:
, In:
Proceedings of the 23rd Asia and South Pacific Design Automation Conference
,
Sun, Wenyu
;
Huang, Yuxuan
;
Zhao, Qinghang
... - p. 645-650 , 2018
Link:
https://dl.acm.org/doi/10.5555/3201607.3201756
RT T1
Proceedings of the 23rd Asia and South Pacific Design Automation Conference
: T1
Mechanical strain and temperature aware design methodology for thin-film transistor based pseudo-CMOS logic array
UL https://suche.suub.uni-bremen.de/peid=acm-3201756&Exemplar=1&LAN=DE A1 Sun, Wenyu A1 Huang, Yuxuan A1 Zhao, Qinghang A1 Qiao, Fei A1 Ho, Tsung-Yi A1 Guo, Xiaojun A1 Yang, Huazhong A1 Liu, Yongpan PB IEEE Press YR 2018 K1 Hardware K1 Hardware validation SP 645 OP 650 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/3201607.3201756 DO https://dl.acm.org/doi/10.5555/3201607.3201756 SF ELIB - SuUB Bremen
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