I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
3D-Xpath : high-density managed DRAM architecture with c..:
, In:
Proceedings of the 27th International Conference on Parallel Architectures and Compilation Techniques
,
Lee, Sukhan
;
Lee, Kiwon
;
Sung, Minchul
... - p. 1-12 , 2018
Link:
https://dl.acm.org/doi/10.1145/3243176.3243191
RT T1 <cTitle>Proceedings of the 27th International Conference on Parallel Architectures and Compilation Techniques</cTitle>: T1 <Title>3D-Xpath : high-density managed DRAM architecture with cost-effective alternative paths for memory transactions</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3243191&Exemplar=1&LAN=DE A1 Lee, Sukhan A1 Lee, Kiwon A1 Sung, Minchul A1 Alian, Mohammad A1 Kim, Chankyung A1 Cho, Wooyeong A1 Oh, Reum A1 O, Seongil A1 Ahn, Jung Ho A1 Kim, Nam Sung PB ACM YR 2018 K1 3D stacked memory K1 asymmetric latency memory K1 hardware managed migration K1 Hardware K1 Integrated circuits K1 Semiconductor memory K1 Dynamic memory K1 Emerging technologies K1 Memory and dense storage K1 Very large scale integration design K1 VLSI packaging K1 Die and wafer stacking SP 1 OP 12 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3243176.3243191 DO https://dl.acm.org/doi/10.1145/3243176.3243191 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
