I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Reliability Evaluation with Heat Dissipation Effect for a K..:

, In: Proceedings of the 2nd International Conference on Telecommunications and Communication Engineering,
Lin, Qian ; Wu, Hai-Feng ; Pan, Ying. - p. 180-184 , 2018
Link: https://dl.acm.org/doi/10.1145/3291842.3291874