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1 Ergebnisse
1
Architecture, Chip, and Package Co-design Flow for 2.5D IC ..:
, In:
Proceedings of the 56th Annual Design Automation Conference 2019
,
Kim, Jinwoo
;
Murali, Gauthaman
;
Park, Heechun
... - p. 1-6 , 2019
Link:
https://dl.acm.org/doi/10.1145/3316781.3317775
RT T1 <cTitle>Proceedings of the 56th Annual Design Automation Conference 2019</cTitle>: T1 <Title>Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3317775&Exemplar=1&LAN=DE A1 Kim, Jinwoo A1 Murali, Gauthaman A1 Park, Heechun A1 Qin, Eric A1 Kwon, Hyoukjun A1 Chaitanya, Venkata A1 Chekuri, Krishna A1 Dasari, Nihar A1 Singh, Arvind A1 Lee, Minah A1 Torun, Hakki Mert A1 Roy, Kallol A1 Swaminathan, Madhavan A1 Mukhopadhyay, Saibal A1 Krishna, Tushar A1 Lim, Sung Kyu PB ACM YR 2019 K1 Hardware K1 Very large scale integration design K1 Hardware validation K1 Emerging technologies K1 Integrated circuits K1 Interconnect SP 1 OP 6 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3316781.3317775 DO https://dl.acm.org/doi/10.1145/3316781.3317775 SF ELIB - SuUB Bremen
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