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1
Exploiting Process Similarity of 3D Flash Memory for High P..:
, In:
Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture
,
Shim, Youngseop
;
Kim, Myungsuk
;
Chun, Myoungjun
... - p. 211-223 , 2019
Link:
https://dl.acm.org/doi/10.1145/3352460.3358311
RT T1 <cTitle>Proceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture</cTitle>: T1 <Title>Exploiting Process Similarity of 3D Flash Memory for High Performance SSDs</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3358311&Exemplar=1&LAN=DE A1 Shim, Youngseop A1 Kim, Myungsuk A1 Chun, Myoungjun A1 Park, Jisung A1 Kim, Yoona A1 Kim, Jihong PB ACM YR 2019 K1 3D NAND Flash Memory K1 Process Similarity K1 Process Variability K1 SSD K1 Hardware K1 Integrated circuits K1 Semiconductor memory K1 Non-volatile memory K1 Computer systems organization K1 Embedded and cyber-physical systems K1 Embedded systems K1 Firmware SP 211 OP 223 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3352460.3358311 DO https://dl.acm.org/doi/10.1145/3352460.3358311 SF ELIB - SuUB Bremen
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