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1 Ergebnisse
1
Full-Chip Electro-Thermal Coupling Extraction and Analysis ..:
, In:
Proceedings of the 2020 International Symposium on Physical Design
,
Zhu, Lingjun
;
Chang, Kyungwook
;
Petranovic, Dusan
... - p. 39-46 , 2020
Link:
https://dl.acm.org/doi/10.1145/3372780.3378169
RT T1
Proceedings of the 2020 International Symposium on Physical Design
: T1
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs
UL https://suche.suub.uni-bremen.de/peid=acm-3378169&Exemplar=1&LAN=DE A1 Zhu, Lingjun A1 Chang, Kyungwook A1 Petranovic, Dusan A1 Sinha, Saurabh A1 Yu, Yun Seop A1 Lim, Sung Kyu PB ACM YR 2020 K1 3d ics K1 parasitic extraction K1 signal integrity K1 thermal analysis K1 Hardware K1 Electronic design automation K1 Physical design (EDA) K1 Very large scale integration design K1 3D integrated circuits SP 39 OP 46 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3372780.3378169 DO https://dl.acm.org/doi/10.1145/3372780.3378169 SF ELIB - SuUB Bremen
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