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1 Ergebnisse
1
Research status and analysis of the surface insulation of t..:
, In:
Proceedings of the 2020 4th International Conference on Electronic Information Technology and Computer Engineering
,
Zhang, Xizi
;
Tang, Xinling
;
Chen, Shu
... - p. 1153-1161 , 2020
Link:
https://dl.acm.org/doi/10.1145/3443467.3443921
RT T1 <cTitle>Proceedings of the 2020 4th International Conference on Electronic Information Technology and Computer Engineering</cTitle>: T1 <Title>Research status and analysis of the surface insulation of the junction terminal of Press Pack IGBT Chips</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3443921&Exemplar=1&LAN=DE A1 Zhang, Xizi A1 Tang, Xinling A1 Chen, Shu A1 Wang, Liang A1 Lin, Zhongkang A1 Zhou, Yang PB ACM YR 2020 K1 Press-pack IGBT K1 electric field calculation K1 insulation design K1 Computing methodologies K1 Modeling and simulation K1 Model development and analysis K1 Model verification and validation SP 1153 OP 1161 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3443467.3443921 DO https://dl.acm.org/doi/10.1145/3443467.3443921 SF ELIB - SuUB Bremen
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