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1 Ergebnisse
1
Novel Methodology for Assessing Chip-Package Interaction Ef..:
, In:
Proceedings of the 2022 International Symposium on Physical Design
,
Kteyan, Armen
;
Choy, Jun-Ho
;
Sukharev, Valeriy
... - p. 83-89 , 2022
Link:
https://dl.acm.org/doi/10.1145/3505170.3511798
RT T1 <cTitle>Proceedings of the 2022 International Symposium on Physical Design</cTitle>: T1 <Title>Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3511798&Exemplar=1&LAN=DE A1 Kteyan, Armen A1 Choy, Jun-Ho A1 Sukharev, Valeriy A1 Bertoletti, Massimo A1 Maiorca, Carmelo A1 Zadra, Rossana A1 Inzaghi, Massimo A1 Gattere, Gabriele A1 Zinco, Giancarlo A1 Valente, Paolo A1 Bardelli, Roberto A1 Valerio, Alessandro A1 Rolandi, Pierluigi A1 Monetti, Mattia A1 Cuomo, Valentina A1 Santapà, Salvatore PB ACM YR 2022 K1 bending K1 chip-package interaction K1 finite element analysis K1 netlist K1 thermo-mechanical stress K1 Hardware K1 Electronic design automation K1 Methodologies for EDA K1 Software tools for EDA SP 83 OP 89 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3505170.3511798 DO https://dl.acm.org/doi/10.1145/3505170.3511798 SF ELIB - SuUB Bremen
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