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1 Ergebnisse
1
Recent Advances and Future Challenges in 2.5D/3D Heterogene..:
, In:
Proceedings of the 2022 International Symposium on Physical Design
,
Karnik, Tanay
- p. 95 ff. , 2022
Link:
https://dl.acm.org/doi/10.1145/3505170.3512295
RT T1 <cTitle>Proceedings of the 2022 International Symposium on Physical Design</cTitle>: T1 <Title>Recent Advances and Future Challenges in 2.5D/3D Heterogeneous Integration</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3512295&Exemplar=1&LAN=DE A1 Karnik, Tanay PB ACM YR 2022 K1 2.5d/3d integration K1 interface standardization K1 packaging K1 Hardware K1 Integrated circuits K1 Interconnect K1 3D integrated circuits SP 95 ff. LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3505170.3512295 DO https://dl.acm.org/doi/10.1145/3505170.3512295 SF ELIB - SuUB Bremen
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