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Tightly Linking 3D Via Allocation Towards Routing Optimizat..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Kim, Suwan ; Chung, Sehyeon ; Kim, Taewhan. - p. 1-6 , 2022
Link: https://dl.acm.org/doi/10.1145/3531437.3539714