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1 Ergebnisse
1
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree..:
, In:
Proceedings of the 28th Asia and South Pacific Design Automation Conference
,
Chiou, Hong-Wen
;
Jiang, Jia-Hao
;
Chang, Yu-Teng
.. - p. 7-12 , 2023
Link:
https://dl.acm.org/doi/10.1145/3566097.3567911
RT T1 <cTitle>Proceedings of the 28th Asia and South Pacific Design Automation Conference</cTitle>: T1 <Title>Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3567911&Exemplar=1&LAN=DE A1 Chiou, Hong-Wen A1 Jiang, Jia-Hao A1 Chang, Yu-Teng A1 Lee, Yu-Min A1 Pan, Chi-Wen PB ACM YR 2023 K1 2.5D IC K1 chiplet placement K1 sequence pair K1 thermal K1 Applied computing K1 Hardware K1 Physical sciences and engineering K1 Electronic design automation K1 Engineering K1 Physical design (EDA) K1 Computer-aided design K1 Arts and humanities K1 Architecture (buildings) K1 Placement K1 Wire routing SP 7 OP 12 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3566097.3567911 DO https://dl.acm.org/doi/10.1145/3566097.3567911 SF ELIB - SuUB Bremen
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