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Challenges for Interconnect Reliability : From Element t..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Varela Pedreira, Olalla ; Zahedmanesh, Houman ; Ding, Youqi.. - p. 106 ff. , 2023
Link: https://dl.acm.org/doi/10.1145/3569052.3578909