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Co-design for Heterogeneous Integration : A Failure Anal..:

, In: Proceedings of the 2023 International Symposium on Physical Design,

Douglas, Erica ; Deitz, Julia ; Ruggles, Timothy... - p. 78-79 , 2023

Link: https://dl.acm.org/doi/10.1145/3569052.3578914

RT 
T1 <cTitle>Proceedings of the 2023 International Symposium on Physical Design</cTitle>: T1 <Title>Co-design for Heterogeneous Integration				: A Failure Analysis Perspective</Title>

UL https://suche.suub.uni-bremen.de/peid=acm-3578914&Exemplar=1&LAN=DE
				
A1 Douglas, Erica
A1 Deitz, Julia
A1 Ruggles, Timothy
A1 Perry, Daniel
A1 Cummings, Damion
A1 Rodriguez, Mark
A1 Valdez, Nichole
A1 Boyce, Brad
PB ACM
YR 2023
K1 artificial intelligence
K1 co-design
K1 failure analysis
K1 heterogeneous integration
K1 machine learning
K1 materials characterization
K1 microelectronics
K1 Computing methodologies
K1 Machine learning
K1 Machine learning approaches
K1 Neural networks
K1 Hardware
K1 Integrated circuits
K1 3D integrated circuits
K1 Emerging technologies
K1 Analysis and design of emerging devices and systems
K1 Emerging architectures
K1 Emerging tools and methodologies
SP 78
OP 79
LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3569052.3578914
DO https://dl.acm.org/doi/10.1145/3569052.3578914
SF ELIB - SuUB Bremen

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