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1 Ergebnisse
1
Recent Progress in the Analysis of Electromigration and Str..:
, In:
Proceedings of the 2023 International Symposium on Physical Design
,
Evmorfopoulos, Nestor
;
Shohel, Mohammad Abdullah Al
;
Axelou, Olympia
... - p. 115-123 , 2023
Link:
https://dl.acm.org/doi/10.1145/3569052.3578919
RT T1
Proceedings of the 2023 International Symposium on Physical Design
: T1
Recent Progress in the Analysis of Electromigration and Stress Migration in Large Multisegment Interconnects
UL https://suche.suub.uni-bremen.de/peid=acm-3578919&Exemplar=1&LAN=DE A1 Evmorfopoulos, Nestor A1 Shohel, Mohammad Abdullah Al A1 Axelou, Olympia A1 Stoikos, Pavlos A1 Chhabria, Vidya A. A1 Sapatnekar, Sachin S. PB ACM YR 2023 K1 electromigration K1 multisegment interconnects K1 reliability K1 steady-state analysis K1 stress K1 transient analysis K1 General and reference K1 Cross-computing tools and techniques K1 Reliability K1 Hardware K1 Very large scale integration design K1 Robustness K1 Hardware reliability K1 Aging of circuits and systems K1 Electronic design automation K1 Physical design (EDA) K1 Integrated circuits K1 Interconnect K1 Metallic interconnect SP 115 OP 123 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3569052.3578919 DO https://dl.acm.org/doi/10.1145/3569052.3578919 SF ELIB - SuUB Bremen
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