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1
On Legalization of Die Bonding Bumps and Pads for 3D ICs:
, In:
Proceedings of the 2023 International Symposium on Physical Design
,
Pentapati, Sai
;
Agnesina, Anthony
;
Brunion, Moritz
.. - p. 62-70 , 2023
Link:
https://dl.acm.org/doi/10.1145/3569052.3578925
RT T1 <cTitle>Proceedings of the 2023 International Symposium on Physical Design</cTitle>: T1 <Title>On Legalization of Die Bonding Bumps and Pads for 3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3578925&Exemplar=1&LAN=DE A1 Pentapati, Sai A1 Agnesina, Anthony A1 Brunion, Moritz A1 Huang, Yen-Hsiang A1 Lim, Sung Kyu PB ACM YR 2023 K1 3d integrated circuits K1 3d routing K1 face-to-face bonding K1 via leglization K1 Hardware K1 Electronic design automation K1 Physical design (EDA) K1 Wire routing K1 Placement K1 Very large scale integration design K1 3D integrated circuits K1 Integrated circuits K1 Logic circuits SP 62 OP 70 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3569052.3578925 DO https://dl.acm.org/doi/10.1145/3569052.3578925 SF ELIB - SuUB Bremen
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