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1 Ergebnisse
1
LEGO: Empowering Chip-Level Functionality Plug-and-Play for..:
, In:
Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3
,
Zhang, Chong
;
Li, Songfan
;
Song, Yihang
... - p. 404-418 , 2023
Link:
https://dl.acm.org/doi/10.1145/3582016.3582050
RT T1 <cTitle>Proceedings of the 28th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 3</cTitle>: T1 <Title>LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3582050&Exemplar=1&LAN=DE A1 Zhang, Chong A1 Li, Songfan A1 Song, Yihang A1 Meng, Qianhe A1 Chen, Minghua A1 Bai, YanXu A1 Lu, Li A1 Zhu, Hongzi PB ACM YR 2023 K1 IoT architecture K1 description language K1 function plug-and-play K1 Computer systems organization K1 High-level language architectures K1 Sensors and actuators K1 Embedded hardware K1 Networks K1 Layering SP 404 OP 418 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3582016.3582050 DO https://dl.acm.org/doi/10.1145/3582016.3582050 SF ELIB - SuUB Bremen
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