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1 Ergebnisse
1
Routing-aware Legal Hybrid Bonding Terminal Assignment for ..:
, In:
Proceedings of the 2024 International Symposium on Physical Design
,
Liu, Siting
;
Jiang, Jiaxi
;
He, Zhuolun
... - p. 75-82 , 2024
Link:
https://dl.acm.org/doi/10.1145/3626184.3633322
RT T1 <cTitle>Proceedings of the 2024 International Symposium on Physical Design</cTitle>: T1 <Title>Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3633322&Exemplar=1&LAN=DE A1 Liu, Siting A1 Jiang, Jiaxi A1 He, Zhuolun A1 Wang, Ziyi A1 Lin, Yibo A1 Yu, Bei A1 Wong, Martin PB ACM YR 2024 K1 3d ics K1 bonding terminal planning K1 divide and conquer K1 generalized assignment problem K1 routing K1 Hardware K1 Integrated circuits K1 3D integrated circuits K1 Electronic design automation K1 Physical design (EDA) SP 75 OP 82 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3626184.3633322 DO https://dl.acm.org/doi/10.1145/3626184.3633322 SF ELIB - SuUB Bremen
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