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1 Ergebnisse
1
Warpage Study by Employing an Advanced Simulation Methodolo..:
, In:
Proceedings of the 2024 International Symposium on Physical Design
,
Choy, Jun-Ho
;
Moreau, Stéphane
;
Brunet-Manquat, Catherine
.. - p. 85-90 , 2024
Link:
https://dl.acm.org/doi/10.1145/3626184.3635284
RT T1 <cTitle>Proceedings of the 2024 International Symposium on Physical Design</cTitle>: T1 <Title>Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3635284&Exemplar=1&LAN=DE A1 Choy, Jun-Ho A1 Moreau, Stéphane A1 Brunet-Manquat, Catherine A1 Sukharev, Valeriy A1 Kteyan, Armen PB ACM YR 2024 K1 chip-package interaction K1 chiplet K1 finite element analysis K1 thermo-mechanical stress K1 warpage K1 Computing methodologies K1 Applied computing K1 Hardware K1 Modeling and simulation K1 Physical sciences and engineering K1 Hardware validation K1 Engineering K1 Arts and humanities K1 Architecture (buildings) K1 Computer-aided design SP 85 OP 90 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3626184.3635284 DO https://dl.acm.org/doi/10.1145/3626184.3635284 SF ELIB - SuUB Bremen
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