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1 Ergebnisse
1
Analysis about High-Speed Trace in PCB of Glass-Weave: The ..:
, In:
Proceedings of the 2023 7th International Conference on Electronic Information Technology and Computer Engineering
,
Sun, Long
;
Liu, Bo
;
Liu, Jin
.. - p. 692-697 , 2023
Link:
https://dl.acm.org/doi/10.1145/3650400.3650515
RT T1 <cTitle>Proceedings of the 2023 7th International Conference on Electronic Information Technology and Computer Engineering</cTitle>: T1 <Title>Analysis about High-Speed Trace in PCB of Glass-Weave: The effect of the PCB of Glass-Weave on insertion loss, impedance and phase of high-speed trace</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3650515&Exemplar=1&LAN=DE A1 Sun, Long A1 Liu, Bo A1 Liu, Jin A1 Tian, Minzheng A1 Wu, Kunyang PB ACM YR 2023 K1 Hardware K1 Printed circuit boards K1 Electromagnetic interference and compatibility SP 692 OP 697 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3650400.3650515 DO https://dl.acm.org/doi/10.1145/3650400.3650515 SF ELIB - SuUB Bremen
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