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1 Ergebnisse
1
Intercircuit: Electroplating with Cavities for Fast Fabrica..:
, In:
Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems
,
Li, Xiaolong
;
Yao, Cheng
;
Zhou, Yujie
... - p. 1-6 , 2024
Link:
https://dl.acm.org/doi/10.1145/3613905.3651098
RT T1 <cTitle>Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems</cTitle>: T1 <Title>Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits</Title> UL https://suche.suub.uni-bremen.de/peid=acm-3651098&Exemplar=1&LAN=DE A1 Li, Xiaolong A1 Yao, Cheng A1 Zhou, Yujie A1 Feng, Shuyue A1 Li, Zhengke A1 Cheng, Yiming A1 Huang, Shichao A1 Dong, Haoye A1 Xue, Mengru A1 Wang, Guanyun PB ACM YR 2024 K1 3D printed electronics;Selective Electroplating K1 conductive filament; K1 Human-centered computing K1 Human computer interaction (HCI) K1 Interaction devices SP 1 OP 6 LK http://dx.doi.org/https://dl.acm.org/doi/10.1145/3613905.3651098 DO https://dl.acm.org/doi/10.1145/3613905.3651098 SF ELIB - SuUB Bremen
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