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1 Ergebnisse
1
Automatic placement algorithms for high packing density V L..:
, In:
Proceedings of the 20th Design Automation Conference
,
Kozawa, T.
;
Terai, H.
;
Ishii, T.
... - p. 175-181 , 1983
Link:
https://dl.acm.org/doi/10.5555/800032.800660
RT T1 <cTitle>Proceedings of the 20th Design Automation Conference</cTitle>: T1 <Title>Automatic placement algorithms for high packing density V L S I</Title> UL https://suche.suub.uni-bremen.de/peid=acm-800660&Exemplar=1&LAN=DE A1 Kozawa, T. A1 Terai, H. A1 Ishii, T. A1 Hayase, M. A1 Miura, C. A1 Ogawa, Y. A1 Kishida, K. A1 Yamada, N. A1 Ohno, Y. PB IEEE Press YR 1983 K1 Hardware K1 Electronic design automation K1 Physical design (EDA) K1 Wire routing K1 Placement K1 Applied computing K1 Arts and humanities K1 Architecture (buildings) K1 Computer-aided design K1 Very large scale integration design K1 Application-specific VLSI designs K1 Application specific processors K1 Physical sciences and engineering K1 Engineering SP 175 OP 181 LK http://dx.doi.org/https://dl.acm.org/doi/10.5555/800032.800660 DO https://dl.acm.org/doi/10.5555/800032.800660 SF ELIB - SuUB Bremen
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