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1 Ergebnisse
1
Understanding Electromigration in Cu-CNT Composite Intercon..:
Lee, Jaehyun
;
Berrada, Salim
;
Adamu-Lema, Fikru
...
IEEE Transactions on Electron Devices. , 2018
Link:
https://aaltodoc.aalto.fi/handle/123456789/33810
RT Journal T1
Understanding Electromigration in Cu-CNT Composite Interconnects
UL https://suche.suub.uni-bremen.de/peid=base-ftaaltouniv:oai:aaltodoc.aalto.fi:123456789_33810&Exemplar=1&LAN=DE A1 Lee, Jaehyun A1 Berrada, Salim A1 Adamu-Lema, Fikru A1 Nagy, Nicole A1 Georgiev, Vihar P A1 Sadi, Toufik A1 Liang, Jie A1 Ramos, Raphael A1 Carrillo-Nunez, Hamilton A1 Kalita, Dipankar A1 Lilienthal, Katharina A1 Wislicenus, Marcus A1 Pandey, Reeturaj A1 Chen, Bingan A1 Teo, Kenneth B.K A1 Goncalves, Goncalo A1 Okuno, Hanako A1 Uhlig, Benjamin A1 Todri-Sanial, Aida A1 Dijon, Jean A1 Asenov, Asen YR 2018 K1 Conductivity K1 Contacts K1 Cu-carbon nanotubes (CNT) composites K1 density functional theory (DFT) K1 Discrete Fourier transforms K1 Electromigration K1 electromigration (EM) K1 electrothermal K1 interconnects K1 Lattices K1 multiscale simulation K1 Resistance K1 self-heating K1 Thermal conductivity JF IEEE Transactions on Electron Devices LK http://dx.doi.org/https://aaltodoc.aalto.fi/handle/123456789/33810 DO https://aaltodoc.aalto.fi/handle/123456789/33810 SF ELIB - SuUB Bremen
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