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1 Ergebnisse
1
SiC Power Devices on QUASIC and SiCOI Smart-Cut ® Substrate..:
Letertre, Fabrice
;
Daval, N
;
Templier, Francois
...
info:eu-repo/semantics/altIdentifier/doi/10.4028/www.scientific.net/MSF.433-436.813. , 2003
Link:
https://hal.science/hal-04091219
RT Journal T1 <Title>SiC Power Devices on QUASIC and SiCOI Smart-Cut ® Substrates: First Demonstrations</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftccsdartic:oai:HAL:hal-04091219v1&Exemplar=1&LAN=DE A1 Letertre, Fabrice A1 Daval, N A1 Templier, Francois A1 Bano, Edwige A1 Planson, Dominique A1 Di Cioccio, Lea A1 Jalaguier, E A1 Bluet, Jean Marie A1 Billon, Thierry A1 Madar, Roland A1 Chante, Jean-Pierre PB HAL CCSD; Trans Tech Publications Inc. YR 2003 K1 QUASIC K1 SICOI K1 SOI K1 wafer bonding K1 Smart-Cut K1 SiC K1 CVD epitaxy K1 Schottky diodes K1 [SPI.NRJ]Engineering Sciences [physics]/Electric power JF info:eu-repo/semantics/altIdentifier/doi/10.4028/www.scientific.net/MSF.433-436.813 LK http://dx.doi.org/https://hal.science/hal-04091219 DO https://hal.science/hal-04091219 SF ELIB - SuUB Bremen
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